3D InCites Podcast
As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
Episodes
146 episodes
Lam Research’s Chee Ping Lee Explains the Role of HBM in Generative AI
In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design. HBM memory has recei...
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Season 4
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Episode 34
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39:11
Comet's Isabella Drolz Explains How 3D X-Ray Uses AI to Help Build AI Chips
In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in ad...
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Season 4
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Episode 33
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20:52
So You Want To Be an Interconnectologist? A Conversation with Simon McElrea of LQDX
In this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging.McElrea discusses his roles at semiconductor ...
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Season 4
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Episode 32
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34:43
Monita Pau and Jiangtao Hu Talk About Addressing The Challenges of Metrology for Advanced Packaging
In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them? In semiconducto...
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Season 4
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Episode 31
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29:58
Tarak Railkar and Benson Chan Preview IMAPS Symposium 2024
In this episode, Tarak Railkar and Benson Chan join Françoise von Trapp for a preview of The IMAPS International Symposium 2024, which takes place in Boston from September 30 to October 3, 2024. This year's symposium focuses ...
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Season 4
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Episode 30
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23:40
Bruce Kim of SurplusGLOBAL: The Impact of the CHIPS Act on the Secondary Equipment Market
In this episode, Françoise von Trapp speaks with Bruce Kim, of SurplusGLOBAL, for an update on the semiconductor secondary equipment market, and how the US. and European Chips Acts are impacting it. They also discuss the trend of to...
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Season 4
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Episode 29
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24:31
30 Years of Underfill Technology: How Societal and Technological Challenges Impact Materials Development
In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development. The conversation focuses on th...
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Season 4
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Episode 28
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26:08
SEMICON West 2024: Updates on The SEMI Climate Consortium and Workforce Development
This episode was recorded live at SEMICON West 2024 – SEMI’s flagship tradeshow where the global industry gathers to showcase its latest products and technologies; and discuss topics critical to the industry’s growth. Two of these continue to b...
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33:18
EXTRA: Witnessing Foundry 2.0 In Action with NHanced Semiconductor's Bob Patti and Carl Petteway
For this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors. She speaks with founder and CEO Bob Patti about his vision for the company, whi...
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Season 4
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Episode 23
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53:29
Navigating The Touchpoints of the Semiconductor Equipment Journey
The semiconductor industry supply chain continues to capture attention as general awareness about the importance of semiconductors in our everyday lives grows.The news of global expansion and ongoing delays of new fabs coming online is cons...
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Season 4
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Episode 22
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43:01
3D InCites Members Share Perspectives from SEMICON West 2024
This week’s episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technology, including lithography, packaging, and materials. Speake...
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Season 4
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Episode 21
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1:45:02
Undersecretary Jose Fernandez on Securing Critical Supply Chains in the 21st Century
Recorded live at SEMICON West 2024, SEMI’s flagship tradeshow where the global semiconductor industry gathers to discuss important matters and showcase new products and technology. This episode features Françoise von Trapp’s c...
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Season 4
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Episode 20
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19:41
Dr. Laurie Locascio, Undersecretary of Commerce, Talks about U.S. Investment in Semiconductor Manufacturing
Recorded live at SEMICON West 2024, the flagship tradeshow for SEMI, where the entire industry gathers to showcase their latest products and technologies. Françoise von Trapp interviews Laurie Locascio, Director of NIST and th...
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Season 4
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Episode 19
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18:03
Siemens' AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs
Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and m...
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Season 4
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Episode 18
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27:38
How Do You Break Through the Silicon Ceiling? A Conversation with Christine King
In this episode, Françoise von Trapp speaks with Christine King, the world’s first woman CEO of a semiconductor company, about her journey from near destitution to success in a male-dominated industry. Christine recently published a memoir abou...
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Season 4
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Episode 18
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33:23
The Saxony Story: How to Develop a Global Semiconductor Cluster
Saxony, Germany, has a strong potential to become a global semiconductor location due to its long history in traditional industries, technological base, vast talent pool, strategic location, and investment in education and new talent. ...
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Season 4
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Episode 17
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37:32
Highlights and Aha! Moments of ECTC 2024: A Recap with Karlheinz Bock and Michael Mayer
Françoise von Trapp talks with ECTC 2024 General Chair, Karlheinz Bock and Program Chair, Michael Mayer about highlights and key takeaways from the 2024 IEEE Electronic Component Technology Conference. (ECTC 2024). Bock and Mayer d...
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Season 4
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Episode 16
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24:53
Community Members Share Insights from ECTC 2024
This episode features conversations at ECTC 2024 with 11 of 3D InCites community members. You’ll learn about their perspectives on the hottest topics of the times such as thermal management and power issues for AI devices, and glass core substr...
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Season 4
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Episode 15
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1:52:16
ECTC 2024: Can Photonics Solve the AI Energy Problem? Why is Process Control so Critical to Advanced Packaging?
Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics, and Chet Lennox,...
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Season 4
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Episode 14
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33:29
SEMI America’s Joe Stockunas Talks About SEMICON West Past, Present and Future
In this preview episode for SEMICON West 2024, Françoise von Trapp and SEMI America’s President Joe Stockunas talk about SEMICON West's Past, Present, and Future. The discussion emphasizes the need for collaboration in the semicondu...
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Season 4
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Episode 14
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25:58
LPKF Laser & Electronic’s Richard Noack Explains the Growing Importance of Glass Substrates for HPC and Chiplet Advanced Packaging
Glass has long been explored as an alternative substrate material to organic laminates and silicon. As high-performance computing and chiplets HPC push the boundaries of existing technology, they are demanding innovative packaging solutions, be...
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Season 4
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Episode 13
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29:58
Conversations with the Winners of the 2024 3D InCites Awards
This episode features the winners of this year’s 3D InCites Awards. These included five technology enablement awards, one sustainability award, the Adele Hars Award for DEI, and an award for Best Place to Work. Nils Anspach, of
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Season 4
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Episode 12
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44:20
Member Spotlight: IMAPS Devices Packaging Conference Celebrates 20 Years
This episode was recorded live at the IMAPS Device Packaging Conference – helping celebrate the event’s 20th year. The record turnout included many of our 3D InCites Community members. Françoise von Trapp spoke with several of them who were exh...
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Season 4
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Episode 11
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54:28
IMAPS Global Business Council: Repatriating the U.S. Semiconductor Ecosystem
This episode was recorded live at IMAPS DPC, where the Spring version of the Global Business Council focused on Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem. To get the complete picture of the collaboration happening, Fra...
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Season 4
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Episode 10
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38:14
The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024
This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, tes...
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Season 4
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Episode 9
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34:13