3D InCites Podcast
As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
Episodes
167 episodes
From Tape-Out to Co-Design: The Evolution of 3DIC Technologies
Pratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore's Law slows, requiring closer integration between chip and package design to maximize performance.• Traditional chip design treated packaging a...
•
Season 5
•
Episode 11
•
36:37
Revolutionizing Semiconductor Quality: The Dynamic Planar CT Advantage
Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving...
•
Season 5
•
Episode 10
•
20:06
The Wireless Golden Gateway: Why Advanced Packaging Professionals Should Attend IMS 2025
The IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee ex...
•
Season 5
•
Episode 9
•
31:45
Acoustic Inspection: The Key to Semiconductor Reliability
Acoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and...
•
Season 5
•
Episode 8
•
31:11
Chip Champions: How The 3D InCites Award Winners Are Revolutionizing Heterogeneous Integration
The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology.•
•
Season 5
•
Episode 7
•
1:01:29
Why Supply Chain Resilience Matters and How to Get It
Navigating today's complex manufacturing landscape demands unprecedented supply chain resilience. This eye-opening conversation with Barry O'Dowd (
•
Season 5
•
Episode 6
•
37:32
3D InCites Member Spotlight: How Advanced Packaging is Transforming the Semiconductor Landscape
The 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion....
•
Season 5
•
Episode 5
•
43:13
From IMAPS DPC 2025: How Arizona's Universities and Schools Are Revolutionizing Semiconductor Education
Arizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnersh...
•
Season 5
•
Episode 4
•
44:27
From IMAPS DPC 2025: How Artificial Intelligence is Transforming Industries and Society
What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussio...
•
Season 5
•
Episode 3
•
24:39
What's In Store for IMAPS DPC 2025: Featuring Amy Lujan, Tim Olson, and Jan Vardaman
Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to...
•
Season 5
•
Episode 2
•
27:31
SEMI ISS 2025 Recap and Semiconductor Market Update
The episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry's journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of ...
•
Season 5
•
Episode 1
•
39:00
The Role of Material Modeling in Semiconductor Packaging Innovation
Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developi...
•
32:56
Koh Young's Michael Zahn Talks About Putting 3D Measurement Technology to Work for Semiconductor Manufacturing
This episode was recorded live at SEMICON Europa. Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies.&nb...
•
Season 4
•
Episode 43
•
18:55
SEMICON Europa 3D InCites Member Spotlight: 20 Under 30 Recipients and More
This episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence,
•
Season 4
•
Episode 42
•
47:37
SEMICON Europa 2024: Can Digital Twins Help Solve Europe's Talent Gap and Build Technical Sovereignty?
In this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe’s technical sovereignty, and how implementing digital twins can help achieve this g...
•
Season 4
•
Episode 41
•
46:13
SEMICON Europa 2024: How Do We Power Sustainable Exponential Growth?
This episode was recorded live at SEMICON Europa in Munich. This year's theme of this year’s conference is "Innovation and Collaboration: Powering Sustainable Exponential Growth". In other words, how the semiconductor industry can work together...
•
Season 4
•
Episode 40
•
43:57
The U.S. CHIPS for America Mash-Up
It's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings th...
•
Season 4
•
Episode 39
•
44:19
Onto Innovation's PACE Partners Talk About Collaborating on Panel-Level Packaging
On September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand ...
•
Season 4
•
Episode 38
•
1:06:25
Witnessing Foundry 2.0 In Action with NHanced Semiconductor's Bob Patti and Carl Petteway
For this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors. She speaks with founder and CEO Bob Patti about his vision for the company, whi...
•
Season 4
•
Episode 23
•
53:29
LIVE from Boston MA: Member Highlights from IMAPS Symposium 2024
Recorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies.
•
Season 4
•
Episode 37
•
1:25:34
IMAPS Society Award Winners Talk About How Belonging to IMAPS Enriched Their Microelectronics Careers
At IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it’s very special to r...
•
Season 4
•
Episode 36
•
20:30
Live from IMAPS Symposium 2024: Updates on the NAPMP, Silicon Photonics and RDL Packaging
This episode was recorded live at the IMAPS International Symposium in Boston MA. Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing Program; Sandeep Sane of Lightmatter; Craig Bishop, De...
•
Season 4
•
Episode 35
•
49:14
Lam Research’s Chee Ping Lee Explains the Role of HBM in Generative AI
In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design. HBM memory has recei...
•
Season 4
•
Episode 34
•
40:38
Comet's Isabella Drolz Explains How 3D X-Ray Uses AI to Help Build AI Chips
In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in ad...
•
Season 4
•
Episode 33
•
20:52
So You Want To Be an Interconnectologist? A Conversation with Simon McElrea of LQDX
In this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging.McElrea discusses his roles at semiconductor ...
•
Season 4
•
Episode 32
•
35:31
