 
  3D InCites Podcast
        As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design,  standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories. 
      
      
    
      Podcasting since 2021 • 180 episodes
    
3D InCites Podcast
Latest Episodes
Building The U.S. Microelectronics Workforce; A Collective Plan for Sustainable Semiconductors
A nationwide talent engine for chips is taking shape—and it’s built to scale. Recorded live at SEMICON West in Phoenix, we sit down with SEMI Foundation leaders to unpack the National Network for Microelectronics Education, a hub-and-node model...
        
          
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            Season 5
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            Episode 23
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          31:24
        
       
    3D InCites Member Spotlight: Why the Front End Needs the Back End To Win in AI
We recorded live at IMAPS with Siemens, ACM Research, Shellback Semiconductor, DECA, Nordson Electronic Solutions, and VIEW Micro Metrology to explore how AI demand, chiplets, and panels are reshaping advanced packaging. We dig into 3D BLOX, th...
        
          
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            Season 5
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            Episode 21
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          1:05:55
        
       
    First Impressions, Lasting Paths at IMAPS Symposium 2025
We record live at IMAPS to follow a first-time attendee’s leap into advanced packaging and a trio of high school students discovering semiconductors, robotics, and career paths that bridge disciplines. Along the way, we unpack speed-to-market, ...
        
          
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            Season 5
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            Episode 20
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          20:23
        
       
    IMAPS Symposium 2025: Chiplets vs. Dielets and the Truth about Co-Packaged Optics
We sit down with Dr. Subu Iyer of UCLA to unpack chiplets vs dielets, why a universal ecosystem is missing, and how sub‑10 µm bump pitch could make protocols optional. Then we ...
        
          
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            Season 5
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            Episode 19
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          45:56
        
       
    The Unseen Force Behind Semiconductor Device Reliability
A semiconductor wafer travels around the globe five times on average before becoming the chip in your smartphone. Each journey represents a potential risk to device reliability that few consumers—or even industry professionals—ever consider.
        
          
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            Season 5
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            Episode 18
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          43:28
        
      