3D InCites Podcast
3D InCites Podcast
SEMI ISS 2025 Recap and Semiconductor Market Update
The episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry's journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends.
Additionally, SEMI's Market Intelligence team dive into the revised 2024 equipment forecast and World Fab Forecast, discussing trends influenced by AI technology and geopolitical factors, especially those linked to China.
As we detail the upswing in equipment sales, driven by Chinese investments and AI progress, we also spotlight the trends shaping both front and back-end equipment markets. From the resurgence of advanced packaging to the anticipated rebound in test equipment, this episode provides a thorough look at the semiconductor industry's current state and its promising future, including insights into the world fab forecast and its implications for the automotive and power sectors.
Highlights:
• Overview of SEMI ISS and its significance in the semiconductor industry
• Highlights on this year's theme: Ready, Set Ramp! and its implications
• Insights on overcoming market uncertainties and challenges
• AI's transformative role in driving semiconductor innovation
• Discussion of upcoming semi events and their importance for networking
• Market intelligence updates on forecasts and growth opportunities
Contact Our Guests on LinkedIn:
- Joe Stockunas, President, SEMI Americas
- Christian Dieseldorf, Senior Analyst, SEMI MIT
- Inna Skvortsova, Market Analyst, SEMI MIT
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
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This episode of the 3D Insights podcast is brought to you by SEMI, the leading microelectronics industry association, with programs that help its members grow their business and address top challenges worldwide. With a global focus on advocacy, the microelectronics supply chain, sustainability and workforce development, semi works with industry leaders to align goals, share best practices and accelerate progress. Learn more at semiorg. Hi there, I'm Francoise von Trapp, and this is the 3D Insights Podcast. Hi everyone, happy New Year and welcome to Season 5 of the 3D Insights Podcast. We are kicking off 2025 with coverage of semi-ISS, because that's always a great way to start the year. Now, the event just wrapped up and while I wasn't able to be there in person this year, I did chat with a few key people who were there. So in this episode, we'll be talking about the week's highlights and key takeaways with Semi America's President, joe Stakounas. We'll also be getting a Semi market update with members of Semi's market intelligence team, ines Kvortsova and Christian Dieseldorf. So welcome to the podcast, everybody.
Joe Stockunas:Thank you, Francoise. Thank you.
Francoise von Trapp:Thank you for having us. So to the podcast everybody. Thank you, Francoise. Thank you. Thank you for having us. So let's start out with some introductions For people who may just be listening to the podcast for the first time. Can you each describe your roles at SEMI Joe? Why don't you kick it off?
Joe Stockunas:Thank you, Francoise. Again, I'm Joe Stockunas and I'm the president of SEMI Americas and I have responsibility for SEMI's activities in North, central and South America.
Francoise von Trapp:Okay, and Inna.
Inna Skortsova:Thank you, Francoise. I'm a market research analyst at SEMI headquarters here and my primary responsibility is tracking semiconductor capital equipment market, as well as partially vaporized materials. I am also managing our SEM same industry statistics data collection programs, which are actually very important and foundational for our research and analysis.
Francoise von Trapp:Okay, and Christian? How about you?
Christian Dieseldorf:Hi, I'm Christian Dieseldorf and I am the Senior Principal Analyst. The senior principal analyst, my responsibility is tracking and forecasting front-end facilities activities from investment capacity, technologies and product types worldwide. Okay.
Francoise von Trapp:We're going to start off with Joe and talk about SEMI ISS. Let's start with the basics. Why does Semi host this event each year?
Joe Stockunas:Francoise. This event's been going on for more than 30 years now. I attended my first event in 1998, and I've been back many times since then. It is the great way to start the year. We all come back from the holidays energized, having taken a break, and really excited to explore and understand what's ahead for this year. And that's the focus of this event. It's about forecasting.
Joe Stockunas:So we have a very traditional format. We start off the first session on Monday. We peel the onion, we start off with a global economist who can speak to what's expected for global GDP this year, and then we go from there and we explore how that is going to impact our market. So then we have an analyst speak to what's expected this year in semiconductor revenue, semiconductor inches of silicon understanding what the market growth looks like this year. Next presentation is always equipment and it's followed by materials, and so we get a really good understanding of what to expect in our market. Then we spend the next two days understanding what the key issues and opportunities are that will affect the market this year and also out for another couple of years, most likely so the next two years or so. It is really well received. It's two and a half days of excellent presentations, but also we really do get a great representation of industry leadership and the networking value of this session is equal to the data that's shared and the information on market opportunities and issues.
Francoise von Trapp:I was just going to say. I always enjoy going and it does help give a reset, especially after the holidays, of what we're going to think about in the coming year and kind of encapsulates it. Who attends this most of the time?
Joe Stockunas:We get business leaders that's the best way to describe it. So it's often folks who are responsible for a P&L, responsible for representing what to expect in the year. We get great participation from a content perspective. We get industry analysts. We get great participation from a content perspective. We get industry analysts. We get Wall Street analysts as well, and then we often have technologists and technology leaders who are sharing what's going on in the technology world and how that impacts our market as well. It's a really good group of folks who represent the industry leadership as a whole and very much on a global basis. It's here in the US, but we get good representation globally.
Francoise von Trapp:It really focuses on the business side of the semiconductor industry, not so much deeply into the technical engineering side of things.
Joe Stockunas:By no means we have. We Advanced Semiconductor Manufacturing Conference in May and that's where that's much more focused. There this is really about the market and the forecast.
Francoise von Trapp:Okay, and there's always a theme, and this year's theme was Ready Fent Ramp. So what were some of the ideas around that and maybe some of the subtext for that?
Joe Stockunas:Numerous people came up and said we're going to get to a trillion dollars, and the consensus right now is we're going to get to a trillion dollars by 2030. This concept really was a vision of our Ajit Manocha, the CEO of Semi, and it's like he's going to be right right now. So then the theme was you know, in the last few years, we've had a lot of activity with chips acts around the world and we've got 102 new fabs that are in various stages of construction at this point, and you know. So ramp is where we're at. You know, we're getting to that point where we're starting to see things come together, and I saw an announcement today where TSMC will be having their first state-of-the-art American-made semiconductors this month. So it's a good example of that ramp that we're talking about.
Francoise von Trapp:And I believe that's happening right in my backyard here in Arizona, in your backyard in Arizona. Yeah, it is Okay. Now, getting to a trillion dollars is no trivial task, right? And there was a lot of things that have happened to get us to that point. Did they talk at all about some of the remaining headwinds? What do listeners need to keep in mind for that?
Joe Stockunas:So absolutely, it's never been easy in our market, the technical challenges, the market opportunities. You know it's very difficult to get a forecast absolutely right. I don't think anyone ever expects that. But they really want to understand where the trends are going and what we need to do to be successful.
Francoise von Trapp:So last year the word of the year for Semi was unprecedented, and this year it's uncertainty. What do we mean by that?
Joe Stockunas:There's a lot going on in the world the trade tensions with China, uncertainties that we've had to deal with on supply chain over the years, the global government issues that we have getting talent that we need those are the principal issues that we're focused on At Semi is having a resilient and reliable supply chain. It all comes down to that and working with it. And then there's also the market uncertainty. So you know we had a really good growth this year in semiconductor revenue. Our number's 22% from semi, and I'll let Ina and Christian handle that later in this discussion. But you know that's a really good number. But there's a bit of a mix there, you know. So AI is going great and it's driving lots of revenue. It's helping with picking memory up out of the dirt after a very difficult year in memory last year. But the rest of the markets are still kind of slugging along, not growing at a 9% growth rate, which was what we need from a Cajun perspective to get to a trillion dollars by 2030.
Francoise von Trapp:Okay, so on the flip side, do you think that any of these headwinds could actually slow us down to not achieve by 2030? Or do you think we are still on track?
Joe Stockunas:2030 is still beyond the firm forecast, but a really interesting thing. Let me start with just what we heard each and every day. So we had three days of meetings we just concluded and each day I heard more than one time our industry experts were getting up on the stage to speak. The message was it's a wonderful time to be in semiconductor. That was the consistent message that we had. So, again, there's more diversification of our market. Ai is here.
Joe Stockunas:There was really confident view that the market drivers for our industry are sound and more diverse than we've ever seen and growth is going to happen. So that's the most important point, I think that I heard this week at ISS it's a wonderful time to be in semiconductors. For those reasons, it's not going to be a walk in the park. We've got to deal with these other issues. We've got to get the workforce development programs up and running in the US and around the globe and compete for talent to get the very best people into our industry. We've got to figure out ways to strengthen our supply chain and ensure that it's reliable and resilient and it doesn't impede our growth.
Francoise von Trapp:So that sounds like some of the key takeaways, then, from the keynotes that you were just talking about?
Joe Stockunas:Yes, just a couple more takeaways AI being the most transformational business opportunity we've seen in 50 years Key takeaway. But then a few of the analysts pointed to we really don't know how big AI is going to be. Two of the analysts that presented provided upsides. The upsides were 13% and, to give you some feel for that, that would be by 2028, we'd be at $1.1 trillion in semiconductor sales by 2028. So really exciting forecast going forward.
Francoise von Trapp:And I guess some of this isn't just because it's being volume driven, it's also value driven by the price of these wafers, and the price of these chips are so much higher that you need less of them to reach that trillion dollar in revenue.
Joe Stockunas:That could discuss. But again, there's the breadth of market. Truly, the AI chips are part of that, but we'll also need communication chips. You're going to need memory, You're going to need a host of chips and the view was that we've got 102 fabs currently in various stages of construction coming on board. We'll need another 22 to 26 if this forecast holds and the upside forecast holds. But to your point, we are at a transition point again here where a wafer is not a wafer, A wafer that goes into AI. Today, an advanced AI processing chip, a GPU if you will. That wafer is worth a half a million dollars and it has probably 20 to 25 chips for each wafer. In contrast, an advanced node wafer that's producing chips for a smartphone, it's going to yield about 300 chips but only have a value of $30,000. So again, a wafer is no longer a wafer.
Francoise von Trapp:Right, okay, so I just wanted to get input on two things. One would be the packaging panel, and for our audience it's very interesting that the topic is meeting the demands of scaling. Is hybrid bonding the answer? Do you have anything to add about that?
Joe Stockunas:It really became apparent last summer at SEMICON West that advanced packaging has been the future for quite some time. Advanced packaging is now. It's very apparent. We had four wonderful participants. We had design folks, we had end-use folks. They illustrated just the value of hybrid bonding. They also illustrated just how difficult it is to do. There are lots of engineering issues associated with it, but it is really a breakthrough and will really help, especially in supporting the AI marketplace.
Joe Stockunas:So they also made the point that there's still plenty of room for growth in monolithic chips. So I think that's what you hear that the hybrid bonding has really strong advantages as we look to go to 3D stacking and that was another point that was made was that you know it's 3D around the board right now. So you know, for advanced logic, we're, of course, going with 3D chips and you know gate all around coming around the corner, and then, of course, for memory, it's all about three dimensions. We're at 200 layers and going to 1,000. And again, from an advanced packaging standpoint, it's truly getting to not 2.5D but 3D, and hybrid bonding's a very capable technology to solve those problems.
Francoise von Trapp:Well, here at 3D InCites, we've been following that for our whole existence, so it's pretty exciting to see hybrid bonding and 3D stacking starting to get the attention it deserves and to be in the forefront, so we're super excited about that.
Joe Stockunas:One more thought, if I may, on. A number of the speakers talked about just how much collaboration is required at this point. So it is really interesting to see how much collaboration is taking place to advance our technologies. We had a wonderful presentation by Prabhu Raga of Applied Materials and he gave the example that we are now at a point where we're able to engineer the use of five different materials in a 10 nanometer space. But then he went on to list how applied materials works with their customers, with academia and even with their competitors to ensure that these technologies can be co-optimized and the chips produced. So really interesting to see. We're very proud of our position in the industry at Semi on how we really promote collaboration across the industry and probably just did a great job of really bringing that forward as to how important collaboration is today in our industry as we go forward and grow.
Francoise von Trapp:Semi's got a new event you wanted to talk about.
Joe Stockunas:We're really excited. It's a Semi Expo so it's kind of a mini Semi's got a new event you wanted to talk about. We're really excited. It's a Semi Expo, so it's kind of a mini SemiCon. Last year SemiCon we had 30,000 people show up this event. This week we had a bit over 300. So this will be kind of in the middle. We're expecting 1,500 to 2,000 people in Indianapolis on April 1st and 2nd.
Joe Stockunas:There's a lot going on in the Midwest. We're calling it Semi-Expo Heartland and we're plowing some new fields here in the heartland of the United States. Lots of activity, excitement in the Midwest and also opportunity. So automotive electronics is one of those key. Again that market diversity I talked about Implementation of machine learning and AI techniques in manufacturing and those two markets. An awful lot of what happens in manufacturing automotive happens in the Midwest. So we're taking Semi and our industry into the Midwest to help develop those markets and really excited, into the Midwest to help develop those markets and really excited. We've got the governor of Indiana coming to kick it off and tremendous support from folks across the Midwest. You know Indiana is our first location but we really have great partnership with the Midwest states as a whole who are really excited about growing semiconductor in their space as well.
Joe Stockunas:Okay, and what about Semicon West A little bit of change, Bringing it to Phoenix into your backyard, Francois.
Francoise von Trapp:Yep Looking forward to it.
Joe Stockunas:First time we're changing venues since, I think, 1990. So it's been quite some time, but there's just so much activity in Phoenix, so over $100 billion worth of investment going on in Phoenix. It makes sense to share the venue for Semicon West between Phoenix and San Francisco. So we'll be back and forth each year and we are off to an unbelievable start in Phoenix. So the show floor was sold out before the end of 24, more than 10 months in advance. We've got a great exhibition floor, we have great content. We'll have over 400 speakers in three days at SemiCon West, and so the last thing I'm focused on this year is I also want to bring some celebration to SemiWest. So we're going to do some things. Phoenix has the convention center, has an outdoor space that we can use to have some parties in the evening too, so we're looking forward to that as well.
Francoise von Trapp:Should be great.
Joe Stockunas:Thank you, I agree All right, thank you, okay.
Francoise von Trapp:So let's shift gears and we're going to talk with our market intelligence team, ina Skvortsova and Christian Dieseldorf. So, ina, let's start with you. Semi just released its global equipment forecast and you're estimating a record sales of $139 billion for 2026.
Inna Skortsova:Yes, françois, we are actually projecting three years of consecutive growth again for capital equipment market, after we had just a mild contraction or correction, better to say in 2023. So, effectively, by 2026, the equipment market is expected to approach 140 billion mark, new industry record, and with that, I think, the capital intensity is remaining high, and and it's for an 18% range of similar revenues.
Francoise von Trapp:Yeah, I imagine, with all of those new fabs coming online, that's what's driving this equipment growth.
Inna Skortsova:Well, there are various factors. In addition to capacity additions that are coming from the new fabs, there are very healthy drivers, including AI. That was practically the topic of the ISS conference. So, yes, there are a number of factors impacting the growth and our projections. We actually revised our 2024 equipment forecast slightly and adjusted 25 and 26 accordingly, based on the current market conditions, and it's actually interesting stories. There are two vectors of the growth. Some of it is technology-driven and AI-driven, and another is more on the geopolitical side.
Francoise von Trapp:Okay, how so with the geopolitical?
Inna Skortsova:side, china is a major factor. So, for example I just mentioned, we changed our forecast for 2024 for equipment and we are finishing actually a little higher than previously expected Now at 6.5% growth over, with a total reaching 112 billion, and this upward revision reflects stronger than previously expected sales to China that those investments were very, very significant. We also saw a pickup in investments to support the AI. If you look at 2023 and almost all 2024, we can say that China is much bigger than AI for the equipment market, I mean say that China is much bigger than AI for the equipment market.
Francoise von Trapp:I mean, your forecast covers both front and back end equipment and we're focused mostly in the advanced packaging space. Can you talk a little bit about the breakdown between front and back end and about the recovery in the back end?
Inna Skortsova:Oh yeah, of course. Looking in general at the portal, VafaF, fab equipment market, we expect 5% growth, reaching 101 billion this year, and this is a little bit higher again than what we expected. And our forecast for 2025 is for market to reach 108 billion, growing 6% comparing to 2024. And that is a little bit lower than we expected six months ago. Some projects slowed down and were pushed out to 2026. There is some shift in dynamics in the forecast, but if we start with the foundry logic equipment standings, start with the foundry logic equipment spendings. These remain stable comparing to 2023 level, reaching about 60 billion, and we expect only small increase of 3% in 2025. But the composition of the spendings will be different, Pivoting to the memory equipment spending for these and coming years. Dram spending expected to finish the 2024 year we're still finalizing with very healthy 35% growth, followed by another 10% growth in 2025. This growth will come from, obviously, investments in high bandwidth memory and some of the capacity additions for DRAM. That will continue in 2026. Dram will see both technology and capacity-driven demand and equipment spending. On the other hand, non-flash equipment market we expect 2024 to finish soft, pretty much flat. Comparing to prior year, 2025, we'll see a huge increase 48%, but that is just coming from the lower base of 2024. Now I understand the audience is very interested in the back-end equipment.
Inna Skortsova:Let me start from test equipment first. In the first half of 2024, test equipment segment was pretty soft comparing to 2023. And we only started to see increases in tests just closer to pretty much in the third quarter and that was because of the quick surge in demand for a related test. That demand will continue. That demand will only be stronger in 25 and 26 and we expect very healthy growth for the test for system on a chip related test. There is some softness and that is generally because of the soft consumer electronics and automotive and industrial segments. But we expect that to improve going forward, Effectively going forward.
Inna Skortsova:We see a huge demand in tests related for HBM and complexity of tests and type of tests for that, With that memory test, we'll see a steady recovery. And complexity of tests and type of tests for that, With that memory test, we'll see a steady recovery. It will see steady recovery in terms of already sees a recovery in terms of utilization rates and in terms of new orders, and that will continue. Most of the investments will be focused on high-end memory, especially for DDR5 and HPMs, as I mentioned earlier.
Francoise von Trapp:What I wanted to know was about the recovery in the back end and what's driving that. So we know that there's a lot of growth in the advanced packaging space, so I can only assume that this is what is driving the growth there.
Inna Skortsova:Yeah, definitely that is one of the growth drivers and you're correct. Like, if you look at 2023, it was the lowest point in terms of the investments in the past five years in assembly and packaging, but we see the demand for packaging coming back and coming back, starting 2024. And that will continue in the next two years. Again, advanced packaging that is related to 2.5 and 3D technology, for what most of it covers, and HBM technology these are the areas where we see the most investments, especially for the technologies like deployment of technologies like hybrid bonding that were discussed today or yesterday at ISS panel. Also, thermal compression bonding. Those are the areas of actual strong growth in assembling packaging equipment segment, in addition to traditional needs for classic packaging.
Francoise von Trapp:Okay, now I think we should move over to Christian to talk about the world fab forecast that was just released, and it was interesting because Joe just mentioned, I think, 108 fabs in construction, but the new forecast is focused on 18 new commercial fabs. Is this because they're just starting construction in 2025?
Christian Dieseldorf:Yeah right, so the 18 is fabs which we estimate will start construction this year. Joe was referring to any fabs which are still in construction. These construction phases can take a long time, up to two years, two to three years even, pending on region and the size of the fab itself.
Francoise von Trapp:Okay, so let's talk about these fabs. Where are they going to be located?
Christian Dieseldorf:Pretty much all over the world and I need to say it's very tricky making this forecast 18. So don't get stuck on 18, because this number can change next week.
Francoise von Trapp:Right.
Christian Dieseldorf:Okay, if a company, let's say Micron, is among one of those, micron and Clay if they decide they don't start construction by the end of 2025, then the number goes down to 17. Okay, right, and so this could change, could go down to 14, or could go down, could go even up to 20, depending what it is, and these are fabs of all different sizes. So we have three 8-inch fabs, the rest are all 12-inch, and they start with 5,000 wafers per month, which is the smallest one, up to over 100,000 wafers per month.
Francoise von Trapp:You talked about 8-inch or 200-millimeter wafer fabs. Well, is it unprecedented that there would be three new 200-millimeter fabs included in this?
Christian Dieseldorf:200 millimeter fabs included in this? No, no, not really, in fact. So in last year we had four. In 2023, we had 10. Okay, and in 2022, we had seven. So in 2025, or so you can see, the number goes down, but again, the number can change. I expect the number to go up even, and one reason is because of power SIC technology. A lot of companies are moving from six inch 150 millimeter to eight inch 200 millimeter the SIC products.
Christian Dieseldorf:Power is one of the driving forces behind all these fabs, as Joe mentioned forces behind all these fabs, as Joe mentioned AI, for example. Ai uses a huge amount of power and we also have electrification going on. We have IoT Don't forget about IoT and other technologies and then we have all the data centers. They need memory, they need power and so on. So I expect some more 8-inch FABs, new 8-inch FABs to be built, and if they can't build new 8-inch FABs because it costs more money, they are converting a 6-inch FAB, 150-millimeter FAB, to 8-inch, and we see that as well. But some of these six-inch fabs are so old that they don't qualify to be converted, to be ready for 200-millimeter equipment. So then the company has to build a new fab.
Francoise von Trapp:That's really interesting because I hadn't thought about the increase in 200 millimeter, because the volume is driving the products from the 150 up to 200. And I also think about the different materials. I mean, when it comes to power semiconductors, there's a lot of different materials than silicon. You know, the compound semiconductors are usually at those smaller wafer sizes.
Christian Dieseldorf:Is there a possibility that that could ever be at 300 millimeter? So one contentor to SIC, silicon carbide, for example, is gallium nitride, right. So gallium nitride you probably see that more on sixinch or 150 millimeter, 200 millimeter, but Infineon, for example, they just have qualified gallium nitride on 300 millimeter. There was an announcement made in September of last year, which is incredible, and, as Joe said before, a wafer is not a wafer anymore. That's so true because you have chips of various sizes. Some of them use leading edge technology, which requires EUV or extreme EUV, and others are for mature technologies where you can build with feature sizes above 22 nanometer.
Francoise von Trapp:Okay, okay, that makes sense. You know, one of the things that a lot of OEMs have been focused on is their new processes designed for 300 millimeter, and one of the things I always hear about is how the 200 millimeter tools haven't been kept up to date with process technology. And then there's also a demand for secondary 200 millimeter equipment. So how is this expansion impacting the OEM side of things?
Christian Dieseldorf:The 200 millimeter used equipment market is pretty much dried out. So there's really not much. I think it dried out quite a few years back. There's really not much. I think it died out quite a few years back. So OEMs are starting to make new 200 millimeter equipment with the specifications requirements which fit a 300 millimeter tool. So these are leading edge. But the question is how much money? How much money do you want to invest as an OEM into 200 millimeter when there are right now only three new fabs starting construction potentially, if they are not pushed out? So you need to look at the market. I don't see the investment to be huge, but I hear that this equipment, the new equipment, is being built.
Francoise von Trapp:Okay, so even the you said last year there were two and the year before that there were 10. Yeah, are those of all, and those have all completed construction and ramped to manufacturing.
Christian Dieseldorf:No, not all of them, uh, but in 23 we had 10, okay, which was a year where we had most of 200 millimeter for a long time, uh, and last year we had four.
Christian Dieseldorf:So these are smaller fabs. It doesn't take two years to build them until ready for production, and so it takes maybe one year, one and a half years again, depending where you are. Some of them have started, some of them have not, and the power the automotive and power industry right now is a little bit slow, but I hear automotive market is slow and I hear companies are pushing out their plans so they may have the FAB and concrete is very patient, right. So you can build your FAB and then you try to get your CHIP-AC funding for it first of all, if you can. Then you have the FAB ready and then you start equipping pending market, and right now we see that being pushed out and slowed down because of the situation we have pending market, and right now we see that being pushed out and slowed down because of the situation we have Okay so for OEMs it's good news, but it might not be this year that they get those tool orders.
Christian Dieseldorf:Well, those, some of these perhaps, which started construction in 2310, again, they, they may still be equipping, okay, right. And the OEMs, they know, I mean there are not so many out there If there's a really new fab being built, they know I don't expect it to be a huge spike. And then, don't forget, there are older fabs, 150 millimeter, where 200 millimeter equipment is being moved in so that transition slowly to larger wafer size, if the fab, the facility, is qualified to do that. So I wouldn't call it a huge spike or this great thing which will happen for the OEMs. It's a more suppressed situation we have right now.
Francoise von Trapp:Okay, well, I think that's super helpful and interesting, but we do have to wrap it up, so tell me about new reports that listeners should be on the lookout for from the SEMI MIT team.
Christian Dieseldorf:So we have quite a few reports forecast. So I do forecast the WorldFab forecast. The next update will be published early March and if you don't want to wait, you can subscribe to our FabView where you have access 24 seven to the database. Let's say I make a change into one of the fabs, like Micron and Clay or Global Foundries in New York, they can see it right away. That's FAB view. And then at the same time we have our 300 millimeter report and 200 millimeter report, which is a forecast which goes to 2028 and to 2030 with an extended edition.
Francoise von Trapp:Okay, that's really cool that they can get information in real time that you're adjusting things on the fly, you know it is great, but if I make a mistake, they also see the mistake. Oh well, we all make mistakes, don't we?
Christian Dieseldorf:Yeah, we do, but I think I get caught. Yeah, you still need to be careful. You want to make sure whatever you enter into the database is solid.
Francoise von Trapp:That's the beauty of editing. So no, I get it, ina.
Inna Skortsova:what new reports do you think listeners should be on the lookout for In the first quarter of this year we are publishing our EMDS Equipment Market Data Subscription Refresh, where we actually provide a deep dive into the forecast that I just mentioned. We also going to finalize 2024 and, on the material side, we are preparing to publish our materials market data subscription report, which will extend the forecast for both wafer farm materials and packaging materials through 2026. I think those are the key reports that might be of interest to your audience and global audience.
Francoise von Trapp:Okay, all right. Well, I want to thank you all for joining me today and it's been great to talk to you, and I kind of feel sad that I wasn't there in person, but we'll try to make it next year.
Christian Dieseldorf:Thank you, Francoise.
Francoise von Trapp:Thank you, Francoise. Where should people go to find out more?
Christian Dieseldorf:Our website semiorg.
Inna Skortsova:Slash.
Francoise von Trapp:Market Intelligence. There we go, okay, thanks so much and take care. Thank you for having us. Thanks so much and take care.
Inna Skortsova:Thank, you for having us.
Francoise von Trapp:Next time on the 3D Insights podcast, I'll be speaking with the organizers of this year's IMAPS Device Packaging Conference to find out what's in store for this year's event and what the key topics will be. You'll hear from General Chair Amy Lujan about this year's keynotes and technology tracks. Co-chair of the General Business Council, tim Olson talks about this year's keynotes and technology tracks. Co-chair of the General Business Council, tim Olson talks about this year's focus on AI for high-performance computing and data centers, and Tech Search's Jan Vardaman gives a glimpse of the panel discussion she'll be leading that has the provocative title Preparing for the Coming AI Winter. Be sure to follow us on your preferred podcast app to get automatic downloads of the latest episodes. Thanks for listening. There's lots more to come, so tune in next time to the 3D Insights Podcast. The 3D Insights Podcast is a production of 3D Insights LLC.