Lam Research’s Chee Ping Lee Explains the Role of HBM in Generative AI Artwork

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Lam Research’s Chee Ping Lee Explains the Role of HBM in Generative AI

October 03, 2024 • Francoise von Trapp / Chee Ping Lee • Season 4 • Episode 34

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In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design.

HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and 3D stacking. Lee explains how HBM uses advanced packaging technologies like TSV and microbumps to achieve high memory capacity and performance. Lam Research's solutions are key to HBM's success.

Listen to learn details about:

The importance of HBM for AI chip manufacturing
The relationship between advancedpackaging and HBM
The differences between different HBM generations
The future of microbumps and hybrid bonding
Lam Research’s advanced packaging solutions

Contact Chee Ping Lee on LinkedIN

Learn more about why HBM Is a critical enabler for generative AI in this blog post.

Lam Research
Lam Research equipment and services allow chipmakers to build smaller and better performing devices

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