Monita Pau and Jiangtao Hu Talk About Addressing The Challenges of Metrology for Advanced Packaging

In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them? 
 
 In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine features. It’s only recently become important to back-end advanced packaging processes – especially for heterogeneous integration. As chips are designed with smaller features, advanced packaging processes are becoming more front-end like. 

You’ll learn about how metrology designed for front-end manufacturing is being reimagined for wafer-level and assembly applications such as:

• Hybrid bonding
• 3D stacking with micro bumps
• RDL applications for interposers
• TSV applications

The speakers discuss the challenges, gaps, and solutions for each. You’ll also learn what makes Onto Innovation uniquely qualified to support this. 

Contact Our Guests on LinkedIn 

·       Monita Pau

·       Jiangtao Hu

Onto Innovation
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