3D InCites Members Share Perspectives from SEMICON West 2024

This week’s episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technology, including lithography, packaging, and materials. Speakers discussed the need to reduce power consumption in AI chips, the potential of using interposers to connect dies without pads, and the ongoing talent crisis in the industry. They also highlighted the importance of sustainability and the potential for the industry to reach a trillion-dollar goal by 2030. Additionally, speakers discussed the expansion of companies in North America, the significance of UV laser debonding, and the investment in electric vehicles and carbon initiatives.

Speakers include: 

• Ken McWilliams, of Multibeam Corporation, and Brad Ferguson of Skywater Technology
•  Ram Trichur, Henkel Technologies 
• Alan Weber, PDF Solutions
• Nirmalya Maity and Zia Karim, Yield Engineering Systems (YES) 
• Martin Elzingre and Jeremy Sanner of Edwards 
•  Dave Kirsch and Thomas Uhrmann of EV Group  
• Spencer Wall and Robert Green of DSV–IMS 
• Chuck Byers, of Monozukuri (MZ Technologies) 
• Meg Conkling, of Veeco
• Bernd Krafthofer of ERS Electronic GmbH 

SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.

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Chapters

• 1:10 Ken MacWilliams, Multibeam
• 10:59 Ram Trichur, Henkel Corporation
• 20:31 Alan Weber, PDF Solutions
• 30:10 Nirmalya Maity and Zia Karim, YES
• 44:17 Martin Elzingre and Jeremy Sanner, Edwards Vacuum
• 53:10 David Kirsch and Thomas Uhrmann, EV Group
• 1:03:55 Spencer Wall and Robert Green, DSV-IMS
• 1:15:18 Chuck Byers, Monozukuri (MZ Technologies)
• 1:24:25 Meg Conkling, Veeco Instruments
• 1:33:42 Bernd Krafthoefer, ERS Electronic, GmbH