Siemens' AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs

Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlighted the growing importance of digital twin technology in the semiconductor industry and the challenges of designing and optimizing 3D ICs, including the need for concurrent design across multiple disciplines.

You'll learn about: 

• Evolution of semiconductor packaging from wire bond to heterogeneous integration and 3D stacking
• 3D IC design tools and their evolution
• Digital twins, chiplet architectures, and 3D integration processes in semiconductor design
• Innovator 3D IC - a new product " for faster, more predictable chip design
• Siemens' new 3D IC design platform for concurrent design and optimization.
• How design teams can take advantage of the digital twin and predictive analysis capabilities in Innovator 3D IC.

Learn more about Innovator 3D IC

Contact AJ Incorvaia on LinkedIn

Siemens EDA
Siemens' EDA software helps you turn today's ideas into the sustainable products of the future.

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