3D InCites Podcast
As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
3D InCites Podcast
Siemens' AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs
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Francoise von Trapp /AJ Incorvaia
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Season 4
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Episode 18
Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlighted the growing importance of digital twin technology in the semiconductor industry and the challenges of designing and optimizing 3D ICs, including the need for concurrent design across multiple disciplines.
You'll learn about:
- Evolution of semiconductor packaging from wire bond to heterogeneous integration and 3D stacking
- 3D IC design tools and their evolution
- Digital twins, chiplet architectures, and 3D integration processes in semiconductor design
- Innovator 3D IC - a new product " for faster, more predictable chip design
- Siemens' new 3D IC design platform for concurrent design and optimization.
- How design teams can take advantage of the digital twin and predictive analysis capabilities in Innovator 3D IC.
Learn more about Innovator 3D IC
Contact AJ Incorvaia on LinkedIn
Siemens' EDA software helps you turn today's ideas into the sustainable products of the future.
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