3D InCites Podcast

As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.

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3D InCites Podcast

Highlights and Aha! Moments of ECTC 2024: A Recap with Karlheinz Bock and Michael Mayer

June 20, 2024 • Françoise von Trapp/Karlheinz Bock and Michael Mayer • Season 4 • Episode 16

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Françoise von Trapp talks with ECTC 2024 General Chair, Karlheinz Bock and Program Chair, Michael Mayer about highlights and key takeaways from the 2024 IEEE Electronic Component Technology Conference. (ECTC 2024).

Bock and Mayer discussed the growth of ECTC 2024, and how focusing on strategic decisions such as changing the format and increasing the exhibition space helped organizers achieve record attendance. They also describe the volunteering opportunities and the pathway to leadership it provides. They shared their own experiences and the impact ECTC has had on their careers.

From the event itself, you'll learn about the importance of packaging technology and collaboration between chip and packaging communities to meet the high bandwidth requirements of AI applications. You'll also learn about advancements in hybrid bonding, metrology, and the impact of geopolitics in electronics packaging.

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