Jean-Christophe Eloy and Jan Vardaman Explain How Chiplets and Advanced Packaging will Rule the World

In this episode, Françoise von Trapp and Jean Christophe Eloy of Yole Group, discuss the future of advanced packaging and chiplets in the semiconductor industry, and how these technologies will revolutionize the industry.  

Get ready for a deep dive into a technology discussion. From Jean-Christophe, you’ll learn how chiplets differ from multichip modules (MCM) and systems-in-package (SiP). He highlights the benefits of chiplets, including optimizing different nodes for specific functions. You’ll also learn about important enabling technologies that ensure the fast and robust connections that hallmark chiplets.

Françoise and Jean-Christophe also discuss the key applications using chiplets for their cost-savings and sustainability benefits. 

 In a bonus interview with Jan Vardaman of TechSearch International, Francoise and Jan discuss how chiplets provide the power efficiency needed for next-generation semiconductor devices.

Contact Our Speakers on LinkedIn:
 

• Jean-Christophe Eloy, President and CEO, Yole Group
• E. Jan Vardaman, President, Techsearch International

SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.