Conversations with the 2022 3D InCites Award Winners – Part 1

We presented the 2022 3D InCites Awards in person on March 10 at the IMAPs Device Packaging Conference. Rather than acceptance speeches, we carved out time throughout the week to interview some winners for the 3D InCites podcast. In this, the first of two episodes we speak with the following award winners and asked them to share their success stories with our listeners. 

First up, a conversation with EMD’s Jeff Catlin, about the company’s commitment to sustainable semiconductor manufacturing. EMD is our 2022 Sustainablity Award Winner. 

Next, you’ll hear from John Lannon of Micross AIT, about the company’s legacy of 3D IC technology development. Micross is the 3D InCites Devices manufacturer of the year. 

Craig Bishop, CTO of Deca, Process of the Year winner, talks about Gen 2. of Adaptive Patterning. He also share’s his personal story of how he came to be part of the advanced packaging industry. It all began with a conversation with his neighbor, Tim Olson, CEO of Deca…

Shelby Nelson, CTO of Mosaic Microsystems, winner of Start-up of the Year, share’s the company’s origin story as women-founded company, through its growth today. 

 ERS electronic GmbH is the 2022 Equipment Supplier of the Year, and Debbie Claire Sanchez joined us to talk about the highlights of the paper she presented on the company’s advances in thermal debonding. She also shared some of her back-story of working at Deca. 

This year’s Herb Reiter Design Tool Award went to Cadence. We spoke with John Park about the company’s first-of-its-kind comprehensive, high-capacity 3D-IC design platform. He also clarifies the difference between a SiP and a chiplet architecture from a design perspective. 

Raja Swaminathan gives an acceptance speech for the DEI Award, explains the role of a Sr. Fellow at AMD. He also talks about AMD’s 3D V-Cache, and explains what he means by True 3D. We continued the discussion of the different between a SiP package and a Chiplet package. 

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

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