3D InCites Podcast

Conversations from SEMICON West Hybrid 2021 – Day Two

December 14, 2021 Francoise von Trapp/Multiple Guests Season 1 Episode 23
3D InCites Podcast
Conversations from SEMICON West Hybrid 2021 – Day Two
Show Notes

As part of our SEMICON West Hybrid 2021 podcast series, Françoise spent lots of time on the show floor, catching up in person with 3D InCites community members and other industry experts to find out how business has been since the last time they saw each other at SEMICON West in 2019. In addition to talking about what they are showcasing in their booths, top of mind topics included the chip shortage, supply chain issues, the talent shortage, managing growth, efforts in sustainable manufacturing, and their hopes and dreams for 2022. 

In this second episode, we hear from: 

  • Rama Puligadda, Kim Arnold, and Alex Smith of Brewer Science, who talk about the company’s growth, its strength in culture as they navigated through the pandemic, about the company’s efforts to foster tenure, helping employees to grow in their career paths, and focusing on diversity, equity and inclusion. 
  •  Subodh Kulkarni, CyberOptics,  who talks about the company’s inspection sensor technology product lines, and how they are addressing the complex needs as heterogeneous integration, chiplets, and 3D packaging take hold. We also talked about how the supply chain and talent shortages have impacted CyberOptics. 
  • Bob Smith of SEMI’s Electronic System Design Alliance, who talks about the important work this technology community does in risk management for the EDA industry, for example, the anti-piracy effort to top the theft of software licensing that plagues the industry and costs billions of dollars annually. 
  • Jonas Discher of PlanOptik, who shared his experience traveling from Germany to attend SEMICON West. He shared that the company celebrated two anniversaries this year – 40 years as a company and 20 years for its location in the U.S. He also talked about the development of copper-plated through glass via (TGV) wafers that allow for interconnection via conductive material through the holes in the wafers. The company kicked off its first project with customers for interposers for 3D wafer-level packaging. 

Find all of today’s speakers on LinkedIn: 

 

 

SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.