Hybrid bonding has been a big story in heterogeneous integration and particularly 3D integration for quite some time. At the recent IMAPS International Symposium, it seemed like every keynote speaker mentioned some sort of hybrid bonding as an enabler for next-generation technology. Everybody is talking about it, everyone wants it – in fact, Xperi recently announced a licensing agreement with YMTC for its DBI hybrid bonding process that the company will use for 3D NAND products. This is the first time DBI is being implemented in volume production for 3D NAND applications.
In this Member Spotlight interview, Xperi’s Craig Mitchell explains the technology behind DBI, the applications it enables, its implementation in 3D NAND, and much more.
To learn more about DBI, visit Invensas.com.
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