This week, we’re wrapping up our conversations from the IMAPS International Symposium, with an extended episode. The questions I’m asking? How have the events of the last 18 months impacted the future of the semiconductor industry, and what are the three things we should be focusing on in advanced packaging right now?
You’ll hear from Jan Vardaman of TechSearch International; Ram Trichur of Henkel Corporation; Curtis Zwenger of Amkor Technology; Robert Avila, Finetech; Jon Medernach, MRSI; Dhiraj Bora, Silitronics; and Craig North, GelPak.
How have the events of the last 18 months impacted the future of the semiconductor industry?
Top of everyone’s mind for question one are things like adjusting to working from home, how tool suppliers adjusted their manufacturing, how the industry thrived despite the challenges, returning to in-person events and what that looks like, securing the semiconductor supply chain, sustainable semiconductor manufacturing, the geopolitical situation, the push to onshoring manufacturing to the US, rebuilding the microelectronics workforce.
What are the three things we should be focusing on in advanced packaging right now?
The importance of collaboration and consortia for heterogeneous integration; silicon photonics; chiplet integration and the need for standardization; increased package size and the implications for materials; advanced node technologies making it to the automotive industry, and much more.
You can connect with today’s speakers on LinkedIn.
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