If you liked Part 1 of Conversations from the IMAPS Symposium, you’re going to love part 2. While my questions are the same, the responses are quite varied. In this episode, you’ll hear from Andy Mackie of Indium Corporation, and Dirk Friebel, of Fraunhofer Institute, as we wrap up Day one of coverage. We’ll also give you a sneak peek of Day 2 with a conversation with Tom Gregorich of Zeiss Process Control Solutions.
So what are these questions? First, I asked how the events of the last 18 months have shaped the future of the semiconductor industry. Second, I asked what are three things that are impacting advanced packaging right now. In this episode, these questions sparked conversation around navigating through the pandemic, the return to in-person events, Fraunhofer’s presence in the USA and what it means, how electric vehicles are impacting advanced packaging requirements, who’s going to handle chiplet assembly, advancements in thermal interface materials, the need for inline X-ray inspection for high volume manufacturing, and all sorts of other things.
Thank you to today’s guests! Here’s where you can find them on LinkedIN:Kiterocket
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