Over the last 18 months, the European semiconductor industry has felt the repercussions of supply chain interruptions due COVID 19 and trade wars, combined with exploding global demand for chips driven by the digital transformation. There are also questions about regional sovereignty and the need to strengthen the local supply chain. To address these topics and more, SEMI Europe is holding its first in-person event since the start of COVID. Aiming at facilitating mutual engagement, the SEMI Packaging Technology Seminar will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts, to collectively strengthen the semiconductor back-end industry in Europe.
In this episode, we speak with Steffen Krohnert, ESPAT Consulting, and Christian Roessle MSE Group about the semiconductor supply challenges Europe is facing, particularly for low-volume advanced packaging, and how members of the SEMI integrated Packaging, Assembly and Test Technology Community (ESiPAT-TC), are addressing them. We also talk about the upcoming seminar, and what attendees will gain by attending.
To learn more about SEMI Europe's Packaging Technology Seminar, visit the website here.
Contact Steffen Kröhnert at ESPAT Consulting
Contact Christian Roessle at MST Group
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