3D InCites Podcast

Jean-Christophe Eloy and Jan Vardaman Explain How Chiplets and Advanced Packaging will Rule the World

February 08, 2024 Francoise von Trapp/ Jean-Christophe Eloy/ Jan Vardaman Season 4 Episode 4
3D InCites Podcast
Jean-Christophe Eloy and Jan Vardaman Explain How Chiplets and Advanced Packaging will Rule the World
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Show Notes

In this episode, Françoise von Trapp and Jean Christophe Eloy of Yole Group, discuss the future of advanced packaging and chiplets in the semiconductor industry, and how these technologies will revolutionize the industry.  

Get ready for a deep dive into a technology discussion. From Jean-Christophe, you’ll learn how chiplets differ from multichip modules (MCM) and systems-in-package (SiP). He highlights the benefits of chiplets, including optimizing different nodes for specific functions. You’ll also learn about important enabling technologies that ensure the fast and robust connections that hallmark chiplets.

Françoise and Jean-Christophe also discuss the key applications using chiplets for their cost-savings and sustainability benefits. 

 In a bonus interview with Jan Vardaman of TechSearch International, Francoise and Jan discuss how chiplets provide the power efficiency needed for next-generation semiconductor devices.

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SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.

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