3D InCites Podcast

Keynote Conversations From SEMICON Europa 2023 On Shaping a Sustainable $1Trillion Era

November 23, 2023 Francoise von Trapp/Multiple Guests Season 3 Episode 40
3D InCites Podcast
Keynote Conversations From SEMICON Europa 2023 On Shaping a Sustainable $1Trillion Era
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Show Notes Chapter Markers

This episode was recorded live from Munich, as the official podcast of SEMICON Europa. The theme of this year’s event is Shaping a Sustainable $1 Trillion Era. Françoise von Trapp talks with some of the keynote speakers about the roles their companies play in achieving this goal. talking with some of the Keynote speakers about the roles their company plays in this task. 

From Paul de Bot of TSMC Europe, you’ll learn about the company’s R&D investment in continued CMOS scaling and 3D integration, as well as a $32B investment worldwide in capacity expansion to support Moore’s Law, specialty technologies for the automotive market, and advanced packaging.  De Bot explains the different strategies used in Europe, including a partnership with Bosch, Infineon, and NXP, and addresses the company’s commitment to green manufacturing and sustainability.  

Imec’s Luc Van Den hove explains what he means by “polycrisis” – a word he used to describe the multitude of challenges facing the world, with a specific focus on climate change, and how imec is working to solve these challenges using AI and data analysis. He also talks about the conundrum of using semiconductors to solve climate change, while trying to half our own carbon footprint. Imec is bringing together the entire ecosystem to address these challenges together. 

Rebecca Dobson, of our member company, Cadence explains the complexities of generative AI, and how it will be a key enabler of growth for the European microelectronics industry. You’ll learn how generative AI impacts team productivity and design team structure, and how it can be used to help us reach our sustainability goals, as well as how it can be used to increase productivity. 

Lihong Cao, of ASE Group, talks about the challenges the advanced packaging sector is facing as we enter the chiplet era and how to address them. You’ll learn about the importance of developing an integrated chiplet design ecosystem. You’ll also learn how heterogeneous integration can help solve industry challenges in a sustainable way. 

Contact our Speakers on LinkedIn:

·      Paul de Bot, General Manager, EMEA at TSMC Europe

·      Luc Van Den hove, President and CEO at imec 

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SEMI
A global association, SEMI represents the entire electronics manufacturing and design supply chain.

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Paul de Bot, TSMC Europe
(Cont.) Paul de Bot, TSMC Europe
Luc Van Den hove, imec