3D InCites Podcast

Nordson Test & Inspection's Chris Rand Explains Approaches to Achieving Zero Defects in Microelectronics Devices Using X-Ray Inspection

August 24, 2023 Francoise von Trapp/Chris Rand Season 3 Episode 28
Nordson Test & Inspection's Chris Rand Explains Approaches to Achieving Zero Defects in Microelectronics Devices Using X-Ray Inspection
3D InCites Podcast
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3D InCites Podcast
Nordson Test & Inspection's Chris Rand Explains Approaches to Achieving Zero Defects in Microelectronics Devices Using X-Ray Inspection
Aug 24, 2023 Season 3 Episode 28
Francoise von Trapp/Chris Rand

 This week’s episode dives deep into the world of X-ray inspection and its many uses in today’s high-density 3D heterogeneous integration technologies for semiconductor manufacturing. Françoise von Trapp speaks with subject matter expert, Chris Rand, of Nordson Test and Inspection. 

 You’ll learn the basics – how X-ray inspection is used in semiconductor manufacturing and how that has changed over the years. The challenges facing manufacturers as heterogeneous integration schemes become more advanced – with 3D stacking and chiplet architectures are also discussed.

You’ll also learn why achieving zero defects is so important for today’s semiconductor and microelectronics devices and the different strategies for achieving zero defects.  

 Lastly, you’ll learn about some solutions provided by Nordson Test and Inspections to help you execute those zero-defect strategies.

You can learn more about the new Quadra Pro at the Nordson Test & Inspection website. 

Contact Our Guest on LinkedIN



Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.

Support the Show.

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

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Show Notes

 This week’s episode dives deep into the world of X-ray inspection and its many uses in today’s high-density 3D heterogeneous integration technologies for semiconductor manufacturing. Françoise von Trapp speaks with subject matter expert, Chris Rand, of Nordson Test and Inspection. 

 You’ll learn the basics – how X-ray inspection is used in semiconductor manufacturing and how that has changed over the years. The challenges facing manufacturers as heterogeneous integration schemes become more advanced – with 3D stacking and chiplet architectures are also discussed.

You’ll also learn why achieving zero defects is so important for today’s semiconductor and microelectronics devices and the different strategies for achieving zero defects.  

 Lastly, you’ll learn about some solutions provided by Nordson Test and Inspections to help you execute those zero-defect strategies.

You can learn more about the new Quadra Pro at the Nordson Test & Inspection website. 

Contact Our Guest on LinkedIN



Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.

Support the Show.

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.