3D InCites Podcast
As a semiconductor industry community, IMAPS 3D InCites content platform and podcasts brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation. The IMAPS 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
3D InCites Podcast
SEMI Europe’s 3D System Summit Panel: Partnering to Overcome Challenges in 3D Integration
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For this week’s episode, we’re taking you to SEMI Europe’s 3D and System Summit, which took place last month in Dresden Germany. If you didn’t get to attend, you’re in luck, because in this episode, Françoise hands over the microphone to Jan Vardaman, who moderated a panel Panel Discussion titled: Customer-Supplier Partnering to Overcome Challenges in 3D. Industry experts Raja Swaminathan, of AMD; Andre Blum, of Audi; and Eric Beyne, imec lend their voices to the conversation.
The panel address the main drivers for 3D in different applications spaces. They also discuss the importance of partnerships and collaboration to implement heterogeneous integration solutions. There is a focus on evolving automotive electronics, and how 3D integration technologies are coming into their own to provide solutions as more advanced technology is needed alongside legacy node products.
Find the Panelists on LinkedIn
· Moderator – Jan Vardaman, Techsearch International
· Raja Swaminathan, AMD
· Andre Blum, Audi
· Eric Beyne, imec