Françoise von Trapp interviews Dave Thomas, of the SPTS Division at KLA, to talk about the evolution of wafer-level packaging, what’s been driving the market to adopt more advanced processes over the past 20 years, and the role KLA and specifically the SPTS division has played in bringing these technologies to commercialization.
The specific technology focus is on plasma dicing, its uses, particularly in die-to-wafer hybrid bonding, and the path to adoption. Thomas addresses in detail some of the process challenges and how SPTS has addressed them. He also talks about the fast-moving technical requirements that make the processes for packaging applications highly competitive.
To learn more about plasma dicing, read this article published by KLA on 3D InCites.
KLA, SPTS Division
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