3D InCites Podcast

The Password is Hybrid Bonding – Insights from ECTC 2023

June 29, 2023 Francoise von Trapp/Multiple Guests Season 3 Episode 19
The Password is Hybrid Bonding – Insights from ECTC 2023
3D InCites Podcast
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3D InCites Podcast
The Password is Hybrid Bonding – Insights from ECTC 2023
Jun 29, 2023 Season 3 Episode 19
Francoise von Trapp/Multiple Guests

This episode of the 3D InCites podcast is brought to you by our sustaining members. Shout out to our first official sustaining members Lori McDonald of Deca, and Brian Schieman, of IMAPS. Thanks for helping us continue to create great content! 

 At ECTC 2023, which took place earlier this month, the password was hybrid bonding. In this episode, you’ll hear from our member companies that specialize in hybrid bonding solutions: Adeia, EV Group, and Onto Innovation. You’ll also hear about a novel die-to-wafer process technology from CEA Leti, and an alternative to Die-to-wafer hybrid bonding being developed by the UCLA CHIPS program.   

Thomas Uhrmann, Markus Wimplinger, and Dave Kirsch, EVGroup, talk about the company’s capabilities in supporting both wafer-to-wafer hybrid bonding, and the work being done at the Heterogeneous Integration Competency Center in Austria.  

Adeia’s Laura Mirkarimi and Abul Nuruzzaman, pioneers of hybrid bonding, help dispel some misconceptions about the commercialization of Die-to-wafer hybrid bonding. They talk about the advantages of investing in not only the technology license but the technology transfer. 

Monica Pau, Onto Innovation, talks about the events focused on hybrid bonding, but also some insights into glass core IC substrates, and Onto Innovation's capabilities in both. 

Emilie Bourjot, CEA-Leti, describes a novel self-assembly process that allows for improved alignment accuracy and increased throughput during die-to-wafer hybrid bonding. 

Subu Iyer, of UCLA CHIPS, offers a new approach to copper-to-copper thermocompression bonding that he says provides an alternative to die-to-wafer hybrid bonding. 

Next up on the 3D InCites Podcast: On July 6, Dave Thomas, of KLA’s SPTS division will talk about the advantages of plasma dicing for die-to-wafer hybrid bonding. That episode is sponsored by KLA. 

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

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This episode of the 3D InCites podcast is brought to you by our sustaining members. Shout out to our first official sustaining members Lori McDonald of Deca, and Brian Schieman, of IMAPS. Thanks for helping us continue to create great content! 

 At ECTC 2023, which took place earlier this month, the password was hybrid bonding. In this episode, you’ll hear from our member companies that specialize in hybrid bonding solutions: Adeia, EV Group, and Onto Innovation. You’ll also hear about a novel die-to-wafer process technology from CEA Leti, and an alternative to Die-to-wafer hybrid bonding being developed by the UCLA CHIPS program.   

Thomas Uhrmann, Markus Wimplinger, and Dave Kirsch, EVGroup, talk about the company’s capabilities in supporting both wafer-to-wafer hybrid bonding, and the work being done at the Heterogeneous Integration Competency Center in Austria.  

Adeia’s Laura Mirkarimi and Abul Nuruzzaman, pioneers of hybrid bonding, help dispel some misconceptions about the commercialization of Die-to-wafer hybrid bonding. They talk about the advantages of investing in not only the technology license but the technology transfer. 

Monica Pau, Onto Innovation, talks about the events focused on hybrid bonding, but also some insights into glass core IC substrates, and Onto Innovation's capabilities in both. 

Emilie Bourjot, CEA-Leti, describes a novel self-assembly process that allows for improved alignment accuracy and increased throughput during die-to-wafer hybrid bonding. 

Subu Iyer, of UCLA CHIPS, offers a new approach to copper-to-copper thermocompression bonding that he says provides an alternative to die-to-wafer hybrid bonding. 

Next up on the 3D InCites Podcast: On July 6, Dave Thomas, of KLA’s SPTS division will talk about the advantages of plasma dicing for die-to-wafer hybrid bonding. That episode is sponsored by KLA. 

How to Start a Podcast Guide: The Complete Guide
Learn how to plan, record, and launch your podcast with this illustrated guide.

Support the Show.

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.