From IMAPS DPC 2023: Demystifying Chiplets with Keith Felton, Chris Scanlan, and Choon Lee

At the 2023 IMAPS Device Packaging Conference, there were a lot of discussions about chiplet technology, both in panel discussions and in general conversations. In this episode, we pulled together several interviews in an attempt to demystify and define chiplets, how they are produced and interconnected, what challenges the industry faces, and what we need to do to overcome them.  

You’ll hear from: 

•  Keith Felton, Siemens EDA 
• Chris Scanlan, Besi
• Choon Lee, JCET Group 

IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.

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