3D InCites Podcast

As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.

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3D InCites Podcast

From IMAPS DPC 2023: Demystifying Chiplets with Keith Felton, Chris Scanlan, and Choon Lee

March 30, 2023 • Francoise von Trapp/Keith Felton/Chris Scanlan/Choon Lee • Season 3 • Episode 6

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At the 2023 IMAPS Device Packaging Conference, there were a lot of discussions about chiplet technology, both in panel discussions and in general conversations. In this episode, we pulled together several interviews in an attempt to demystify and define chiplets, how they are produced and interconnected, what challenges the industry faces, and what we need to do to overcome them.

You’ll hear from:

Keith Felton, Siemens EDA
Chris Scanlan, Besi
Choon Lee, JCET Group

Digital Disruption with Geoff Nielson
Discover how technology is reshaping our lives and livelihoods.

Listen on: Apple Podcasts Spotify

IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.

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