3D InCites Podcast

As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.

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3D InCites Podcast

A Conversation about the Future of Semiconductor Packaging and Test in Europe

December 15, 2022 • Steffen Kröhnert/Various guests • Season 2 • Episode 41

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This episode was recorded live during the Advanced Packaging Sympoisium at SEMICON Europa on November 16. 2022. Steffen Kröhnert, President & Founder, ESPAT-Consulting, moderates a panel discussion with members of the semiconductor packaging service provider community in Europe. The topic? The Future of semiconductor manufacturing in Europe – and specifically, back-end packaging and test.

Kröhnert sets the stage by providing an overview of the current availability of semiconductor packaging in Europe. Panelists Oliver Maiwald, CEO, Sencio B.V. and Jan de Koning Gans, Managing Director, RoodMicrotec GmbH, talk about their respective offerings, and discuss the desire to build a robust packaging ecosystem to support the European semiconductor supply chain. Q&A with audience wraps up the conversation.

Contact the Panel on LinkedIn:

Steffen Kröhnert, President & Founder, ESPAT-Consulting
Oliver Maiwald, CEO, Sencio B.V.
Jan de Koning Gans, Managing Director, RoodMicrotec GmbH

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