3D InCites Podcast

A Conversation about the Future of Semiconductor Packaging and Test in Europe

December 15, 2022 Steffen Kröhnert/Various guests Season 2 Episode 41
3D InCites Podcast
A Conversation about the Future of Semiconductor Packaging and Test in Europe
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Show Notes

This episode was recorded live during the Advanced Packaging Sympoisium at SEMICON Europa on November 16. 2022. Steffen Kröhnert, President & Founder, ESPAT-Consulting, moderates a panel discussion with members of the semiconductor packaging service provider community in Europe. The topic? The Future of semiconductor manufacturing in Europe – and specifically, back-end packaging and test. 

Kröhnert sets the stage by providing an overview of the current availability of semiconductor packaging in Europe. Panelists Oliver Maiwald, CEO, Sencio B.V. and Jan de Koning Gans, Managing Director, RoodMicrotec GmbH, talk about their respective offerings, and discuss the desire to build a robust packaging ecosystem to support the European semiconductor supply chain. Q&A with audience wraps up the conversation. 

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