3D InCites Podcast

SEMICON Europa Member Spotlight: Conversations about the EU & US Chips Act and What’s New

December 01, 2022 Francoise von Trapp/Multiple Guests Season 2 Episode 39
SEMICON Europa Member Spotlight: Conversations about the EU & US Chips Act and What’s New
3D InCites Podcast
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3D InCites Podcast
SEMICON Europa Member Spotlight: Conversations about the EU & US Chips Act and What’s New
Dec 01, 2022 Season 2 Episode 39
Francoise von Trapp/Multiple Guests

In this episode, recorded live at SEMICON Europa in Munich the week of November 14-18, 2022, Françoise von Trapp speaks with 3D InCites member companies that either exhibited, presented, or in some cases, both, at the event. Conversations range from discussions about this year's event compared with the 2021 show, the impact of the respective EU and US CHIPS and Acts on their businesses, and the technology innovations they showcased at the show.  

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In this episode, recorded live at SEMICON Europa in Munich the week of November 14-18, 2022, Françoise von Trapp speaks with 3D InCites member companies that either exhibited, presented, or in some cases, both, at the event. Conversations range from discussions about this year's event compared with the 2021 show, the impact of the respective EU and US CHIPS and Acts on their businesses, and the technology innovations they showcased at the show.  

Guests and Companies

FInd these Articles on 3D InCites

How to Start a Podcast Guide: The Complete Guide
Learn how to plan, record, and launch your podcast with this illustrated guide.

Support the Show.

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Peter Dijkstra, Trymax
Alan Weber, Cimetrix by PDF Solutions
(Cont.) Alan Weber, Cimetrix by PDF Solutions
Dieter Rathei and Krista Topper, DR Yield
Thomas Fries, Formfactor
Heiko Dudek, Siemens EDA; Raphael Theveniau, ST Microelectronics
Jim Garstka, Plasma-Therm
Byron Exarcos, John Voltz, ClassOne Technology
Ralph Zoberbier, Evatec
Debbie Claire Sanchez and Sophia Oldeide of ERS electronic GmbH
JIm Straus and Sally Ann Henry, ACM Research
Ram Trichur, Henkel Corporation
Mike Rosa, Onto Innovation