In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting.
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies, which the duo published in 2019. This book picks up where the first one left off, with 11 new chapters including contributions from some of the same companies that participated before, as well as new ones.
The book examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges, and is filled with contributions from some of the field’s leading experts.
In the interview, Beth talks about the book’s backstory, why and how it was written, and who participated. She also explains why they decided to begin the book with a market report, and how the book is a snapshot in time.Support the show
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.