3D InCites Podcast

Member Spotlight: Conversations from 2022 MAPS International Symposium

October 20, 2022 Francoise von Trapp/Multiple Guests Season 2 Episode 34
Member Spotlight: Conversations from 2022 MAPS International Symposium
3D InCites Podcast
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3D InCites Podcast
Member Spotlight: Conversations from 2022 MAPS International Symposium
Oct 20, 2022 Season 2 Episode 34
Francoise von Trapp/Multiple Guests

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25 of our community members participated in the 2022 IMAPS International Symposium in Boston, MA, which was held during the first week of October. This episode features conversations about what they were presenting and showcasing, and what they learned during the week. 

 Craig North, of Gel-Pak, is on a mission to find out as much as he can about chiplet processes and technology, to identify gaps that can be filled by Gel Pak products and services. 

 Bob Connor and Kevin Oswalt of X-Celeprint. Kevin talked about the paper he presented at IMAPS on micro-transfer printing (MTP) at the conference and creating the III_V heterogeneous integration ecosystem. 

Bill Acito, of Member company Siemens, presented on silicon substrate design for BGA designers.

 Carlotta Baumann, the new CEO of Finetech, talks about stepping into the role in the midst of COVID, and into the shoes of a 22-year veteran not only as a woman but as the sole owner of the company.

Tim Olson, CEO of

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IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.

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25 of our community members participated in the 2022 IMAPS International Symposium in Boston, MA, which was held during the first week of October. This episode features conversations about what they were presenting and showcasing, and what they learned during the week. 

 Craig North, of Gel-Pak, is on a mission to find out as much as he can about chiplet processes and technology, to identify gaps that can be filled by Gel Pak products and services. 

 Bob Connor and Kevin Oswalt of X-Celeprint. Kevin talked about the paper he presented at IMAPS on micro-transfer printing (MTP) at the conference and creating the III_V heterogeneous integration ecosystem. 

Bill Acito, of Member company Siemens, presented on silicon substrate design for BGA designers.

 Carlotta Baumann, the new CEO of Finetech, talks about stepping into the role in the midst of COVID, and into the shoes of a 22-year veteran not only as a woman but as the sole owner of the company.

Tim Olson, CEO of

How to Start a Podcast Guide: The Complete Guide
Learn how to plan, record, and launch your podcast with this illustrated guide.
What If? So What?
We discover what’s possible with digital and make it real in your business

Listen on: Apple Podcasts   Spotify

Climate Confident
With a new episode every Wed morning, the Climate Confident podcast is weekly podcast...

Listen on: Apple Podcasts   Spotify

IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.

Support the Show.

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Craig North, Gel-Pak
Bob Connor and Kevin Oswalt of X-Celeprint
Bill Acito, Siemens
(Cont.) Bill Acito, Siemens
Carlotta Baumann, Finetech
Tim Olson, Deca
(Cont.) Carlotta Baumann, Finetech
Casey Krawiec, Tim Going, StratEdge Corporation
Keith Best, Onto Innovation
(Cont.) Keith Best, Onto Innovation
Dick Otte, QP Technologies