3D InCites Podcast

Member Spotlight: Conversations from SEMICON West 2022 and DAC 2022

Francoise von Trapp/Multiple Guests Season 2 Episode 23

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In this episode, we visit 3D InCites member companies on the trade show floor at SEMICON West and the Design Automation Conference to learn about what they are showcasing this year.

 Dave Kirsch and Paul Lindner of EV Group talk about the latest achievement in die-to-wafer fusion and hybrid bonding, and what it means for multi-die system-on-chip.  They also share BIG news about 3D ICs. 

 Alan Weber, Cimetrix, a division of PDF Solutions, talked about the company’s connectivity and control products for automated fabs and the data pipeline its technology enables. Weber emphasized the use of streaming data to improve supply chain challenges. 

 Faraz Shoukat of Anemoi Software walks us through a demonstration if the company’s cloud-based thermal modeling tool for multichip modules, stacked die, and chiplet integration. 

 Monita Pau of Onto Innovation talks about the importance of particle inspection for hybrid bonding, and the focus on panel-level packaging. 

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A global association, SEMI represents the entire electronics manufacturing and design supply chain.

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