3D InCites Podcast

Conversations from the 2022 IMAPS SiP Conference Part 2

July 07, 2022 Francoise von Trapp/Multiple Guests Season 2 Episode 19
Conversations from the 2022 IMAPS SiP Conference Part 2
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3D InCites Podcast
Conversations from the 2022 IMAPS SiP Conference Part 2
Jul 07, 2022 Season 2 Episode 19
Francoise von Trapp/Multiple Guests

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ASE’s Mark Gerber, Amkor’s Curtis Zwenger, and Quorvo’s Matthew Poulton talk about 5G Technology Challenges; Synopsys' Ming Zhen talks about the Era of SysMoore; Start-up competition competitors give mini-pitches. 

While the rollout of 5G is underway, there are remaining technology challenges that must be solved before we can really experience the full benefits of 5G. This was the topic of for the panel discussion at the IMAPs SiP Conference. We invited the panelists to talk about it on the podcast: Mark Gerber from ASE, Curtis Zwenger of Amkor, and Matthew Poulton, Qorvo.

We talked about the hype around the 5G that’s been deployed today, vs mmWave technology needed for new 5G. We also discussed the challenges for the advanced packaging community to develop the technologies needed to support the higher frequencies needed to support 5G. Questions asked and answered include:
 
·      Why are 5G download speeds no better than LTE today? 

·      Is what we are experiencing in 5G really truly 5G? 

·      What needs to happen for 5G to be ready for automotive applications? 

·      Why do we experience more dropped calls on a 5G phone than LTE? 

 Ming Zhang, Synopsys, talks about his career path from his Ph.D. in rad-hard circuit design, to IC design at Intel, chiplet design at Z-Glue, to Synopsys. Traditionally a front-end EDA company, Synopsys began to invest in advanced packaging design just a few years ago. He also talks about the new era of “SysMoore”, focusing on three enabling capabilities and opportunities for design: software, system, and security. The goal is to show How to get better chips, done faster, used by more people and things, focusing on the quality of product, speed of innovation, and scale of deployment. 

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ASE’s Mark Gerber, Amkor’s Curtis Zwenger, and Quorvo’s Matthew Poulton talk about 5G Technology Challenges; Synopsys' Ming Zhen talks about the Era of SysMoore; Start-up competition competitors give mini-pitches. 

While the rollout of 5G is underway, there are remaining technology challenges that must be solved before we can really experience the full benefits of 5G. This was the topic of for the panel discussion at the IMAPs SiP Conference. We invited the panelists to talk about it on the podcast: Mark Gerber from ASE, Curtis Zwenger of Amkor, and Matthew Poulton, Qorvo.

We talked about the hype around the 5G that’s been deployed today, vs mmWave technology needed for new 5G. We also discussed the challenges for the advanced packaging community to develop the technologies needed to support the higher frequencies needed to support 5G. Questions asked and answered include:
 
·      Why are 5G download speeds no better than LTE today? 

·      Is what we are experiencing in 5G really truly 5G? 

·      What needs to happen for 5G to be ready for automotive applications? 

·      Why do we experience more dropped calls on a 5G phone than LTE? 

 Ming Zhang, Synopsys, talks about his career path from his Ph.D. in rad-hard circuit design, to IC design at Intel, chiplet design at Z-Glue, to Synopsys. Traditionally a front-end EDA company, Synopsys began to invest in advanced packaging design just a few years ago. He also talks about the new era of “SysMoore”, focusing on three enabling capabilities and opportunities for design: software, system, and security. The goal is to show How to get better chips, done faster, used by more people and things, focusing on the quality of product, speed of innovation, and scale of deployment. 

Start-up Co
How to Start a Podcast Guide: The Complete Guide
Learn how to plan, record, and launch your podcast with this illustrated guide.
What If? So What?
We discover what’s possible with digital and make it real in your business

Listen on: Apple Podcasts   Spotify

Climate Confident
With a new episode every Wed morning, the Climate Confident podcast is weekly podcast...

Listen on: Apple Podcasts   Spotify

Support the Show.

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

(Cont.) Conversations from the 2022 IMAPS SiP Conference Part 2
(Cont.) Conversations from the 2022 IMAPS SiP Conference Part 2
(Cont.) Conversations from the 2022 IMAPS SiP Conference Part 2