3D InCites Podcast
As a semiconductor industry community, IMAPS 3D InCites content platform and podcasts brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation. The IMAPS 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
3D InCites Podcast
Conversations from the 2022 IMAPS SiP Conference Part 1
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Qualcomm’s Chidi Chidambaram talks about system technology co-optimization; ASE’s Mark Gerber Talks about the VIPack Platform; Daniel Graf, Zero EC, talks about solving data bottlenecks.
This episode was recorded live at the 2022 IMAPS Advanced SiP Conference, where the focus is on SiP technology developments, solutions and business trends. The first interview is with keynote speaker, Chidi Chidambaram, Qualcomm, who talked about system-level optimization opportunities and challenges in the era of slowing silicon process technology. In this podcast interview, Chidambaram explained why Qualcomm is not at the forefront of 3D IC and has focused on SiP solutions. He shared some of the key takeaways from his talk and answered Françoise’s questions about what he calls the connected intelligent edge, and why that’s important for the microelectronics industry. He also discusses the company’s position on chiplet technologies, and why it will be some time before they consider it for mobile applications.
Mark Gerber unpacks ASE’s new platform, VIPack. He talks about the motivation behind the platform. The capabilities of its core technologies and target applications. He also discusses the company’s role in the Universal Chiplet Integration Express (UCIe) as an effort to develop standardization for interfaces.
Daniel Graf, head of business development at Zero EC. The EC stands for Energy Connection. This start-up is an IP developer for semiconductor applications to solve data transport bottlenecks. He explains the challenges of data transfer, and how much energy is wasted during the process. Graf describes the solution his company has come up with to solve the issue.
Guest Contacts
- Chidi Chidambaram, Qualcomm
- Mark Gerber, ASE Group
- Daniel Graf, Zero EC
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