3D InCites Podcast
Conversations from the 2022 IMAPS SiP Conference Part 1
Qualcomm’s Chidi Chidambaram talks about system technology co-optimization; ASE’s Mark Gerber Talks about the VIPack Platform; Daniel Graf, Zero EC, talks about solving data bottlenecks.
This episode was recorded live at the 2022 IMAPS Advanced SiP Conference, where the focus is on SiP technology developments, solutions and business trends. The first interview is with keynote speaker, Chidi Chidambaram, Qualcomm, who talked about system-level optimization opportunities and challenges in the era of slowing silicon process technology. In this podcast interview, Chidambaram explained why Qualcomm is not at the forefront of 3D IC and has focused on SiP solutions. He shared some of the key takeaways from his talk and answered Françoise’s questions about what he calls the connected intelligent edge, and why that’s important for the microelectronics industry. He also discusses the company’s position on chiplet technologies, and why it will be some time before they consider it for mobile applications.
Mark Gerber unpacks ASE’s new platform, VIPack. He talks about the motivation behind the platform. The capabilities of its core technologies and target applications. He also discusses the company’s role in the Universal Chiplet Integration Express (UCIe) as an effort to develop standardization for interfaces.
Daniel Graf, head of business development at Zero EC. The EC stands for Energy Connection. This start-up is an IP developer for semiconductor applications to solve data transport bottlenecks. He explains the challenges of data transfer, and how much energy is wasted during the process. Graf describes the solution his company has come up with to solve the issue.
Guest Contacts
- Chidi Chidambaram, Qualcomm
- Mark Gerber, ASE Group
- Daniel Graf, Zero EC
With a new episode every Wed morning, the Climate Confident podcast is weekly podcast...
Listen on: Apple Podcasts Spotify
KiterocketA global strategic marketing agency serving the semiconductor and sustainability industries.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
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Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Qualcomm’s Chidi Chidambaram talks about system technology co-optimization; ASE’s Mark Gerber Talks about the VIPack Platform; Daniel Graf, Zero EC, talks about solving data bottlenecks.
This episode was recorded live at the 2022 IMAPS Advanced SiP Conference, where the focus is on SiP technology developments, solutions and business trends. The first interview is with keynote speaker, Chidi Chidambaram, Qualcomm, who talked about system-level optimization opportunities and challenges in the era of slowing silicon process technology. In this podcast interview, Chidambaram explained why Qualcomm is not at the forefront of 3D IC and has focused on SiP solutions. He shared some of the key takeaways from his talk and answered Françoise’s questions about what he calls the connected intelligent edge, and why that’s important for the microelectronics industry. He also discusses the company’s position on chiplet technologies, and why it will be some time before they consider it for mobile applications.
Mark Gerber unpacks ASE’s new platform, VIPack. He talks about the motivation behind the platform. The capabilities of its core technologies and target applications. He also discusses the company’s role in the Universal Chiplet Integration Express (UCIe) as an effort to develop standardization for interfaces.
Daniel Graf, head of business development at Zero EC. The EC stands for Energy Connection. This start-up is an IP developer for semiconductor applications to solve data transport bottlenecks. He explains the challenges of data transfer, and how much energy is wasted during the process. Graf describes the solution his company has come up with to solve the issue.
Guest Contacts
- Chidi Chidambaram, Qualcomm
- Mark Gerber, ASE Group
- Daniel Graf, Zero EC
With a new episode every Wed morning, the Climate Confident podcast is weekly podcast...
Listen on: Apple Podcasts Spotify
KiterocketA global strategic marketing agency serving the semiconductor and sustainability industries.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
