3D InCites Podcast

Conversations from the ECTC 2022 Technology Corner

June 16, 2022 Francoise von Trapp/Multiple Guests Season 2 Episode 17
Conversations from the ECTC 2022 Technology Corner
3D InCites Podcast
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3D InCites Podcast
Conversations from the ECTC 2022 Technology Corner
Jun 16, 2022 Season 2 Episode 17
Francoise von Trapp/Multiple Guests

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Françoise hit Technology Corner at the IEEE Electronic Components Technology Conference 2022, May 31-June 3, interviewing 3D InCites member companies about being back in person, and their perspectives of some of the key industry challenges such as supply chain issues, sustainability; diversity, equity, and inclusion efforts, new technology advancements, and much more. 

Tanja Braun, Fraunhofer - IZM, accepted the 3D InCites Award and shared some of the results of the PLP consortium 2.0. We talked about the challenges of standardizing panel sizes, the progress made, and what’s next for a possible third-phase of development.  

Diane Scheele, EMD, Ken Araujo, Namics; and Dean Payne, Indium all talk about the challenges materials suppliers in meeting sustainability requirements for semiconductor and microelectronics manufacturing.  

John Park, Cadence, talks about how EDA tools for packaging have evolved from PCB based to chip design based. He also talked about the company’s new Thermal Solver tool, Celsius.  

Patrick Parin, Micross, talks about the supply chain shortages, how it’s impacting the company, and the steps they are taking to anticipate and mitigate the situation. 

Robert Avila, Finetech, talks about the company’s new die bonding platform, Pico 2. He also talked about dealing with lead times and price increases as part of the supply chain shortage. 

Robin Davis, Deca

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Send us a Text Message.

Françoise hit Technology Corner at the IEEE Electronic Components Technology Conference 2022, May 31-June 3, interviewing 3D InCites member companies about being back in person, and their perspectives of some of the key industry challenges such as supply chain issues, sustainability; diversity, equity, and inclusion efforts, new technology advancements, and much more. 

Tanja Braun, Fraunhofer - IZM, accepted the 3D InCites Award and shared some of the results of the PLP consortium 2.0. We talked about the challenges of standardizing panel sizes, the progress made, and what’s next for a possible third-phase of development.  

Diane Scheele, EMD, Ken Araujo, Namics; and Dean Payne, Indium all talk about the challenges materials suppliers in meeting sustainability requirements for semiconductor and microelectronics manufacturing.  

John Park, Cadence, talks about how EDA tools for packaging have evolved from PCB based to chip design based. He also talked about the company’s new Thermal Solver tool, Celsius.  

Patrick Parin, Micross, talks about the supply chain shortages, how it’s impacting the company, and the steps they are taking to anticipate and mitigate the situation. 

Robert Avila, Finetech, talks about the company’s new die bonding platform, Pico 2. He also talked about dealing with lead times and price increases as part of the supply chain shortage. 

Robin Davis, Deca

How to Start a Podcast Guide: The Complete Guide
Learn how to plan, record, and launch your podcast with this illustrated guide.
What If? So What?
We discover what’s possible with digital and make it real in your business

Listen on: Apple Podcasts   Spotify

Climate Confident
With a new episode every Wed morning, the Climate Confident podcast is weekly podcast...

Listen on: Apple Podcasts   Spotify

Support the Show.

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

(Cont.) Conversations from the ECTC 2022 Technology Corner
(Cont.) Conversations from the ECTC 2022 Technology Corner
(Cont.) Conversations from the ECTC 2022 Technology Corner