3D InCites Podcast

A Conversation about What's Happening at the IMAPS Device Packaging Conference

March 03, 2022 Francoise von Trapp, Beth Keser, James Haley Season 2 Episode 3
3D InCites Podcast
A Conversation about What's Happening at the IMAPS Device Packaging Conference
Show Notes

IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and we at 3D InCites are very excited! It’s been two years since the event took place in person. In fact, it was the last event I attended before the world shut down – literally two weeks later. Even then, the buzz was about COVID 19, elbow bumping and hand sanitizing. Masks weren’t even a thing yet. It was also the last time we held the 3D InCites Awards Ceremony in person. Last year, we went virtual. So we thought it would be great to kick things off and generate some excitement by inviting Beth Keser, IMAPS new President, and Jim Haley, VP of Marketing, to talk about what’s in store for attendees. We talk about the programming, the exhibits, networking opportunities, the collaboration between 3D InCites and IMAPS to bring you future podcast episodes and more. 

Here's where you can learn more about what we discussed: 


·      IMAPS Device Packaging Conference Program and Registration 

·      IMAPS Golf Outing 

·      3D InCites Award Winners

·      Hike for DEI 

Email Françoise for DEI Sponsorship information or to sponsor a podcast episode 

Beth Keser, Ph.D. is a recognized global leader in the semiconductor packaging industry with over 24 years of experience. She received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 34 patents and patents pending and over 50 publications in the semiconductor industry. Based in San Diego, Beth leads Intel’s Packaging & Systems Technology department in the Product Enablement Solutions Group.  Beth is currently IMAPS President and has taught a Professional Development Course on Fan-Out Wafer Level Packaging at conferences since 2015.
Connect with Beth Keser on LinkedIn 

James Haley is a passionate leader with cross functional experience in early adoptive and fortune 100 companies.  Background and experience range in bridging businesses from start up to commercial success.  Active areas of expertise business strategy, strategic marketing, product development and strategic selling in prior companies.

Mr. Haley received his Bachelor of Business Degree from St. Norbert College in Wisconsin.  He participates in several organizations relating to the electronics industry and is an active member in IMAPS, IPC and the USPAE.
Connect with James Haley on LinkedIn 

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

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